Ku0026s 4124 wire bonder manual

 · Kus manual. The bonding cycle is modified when the Manual Z lever is used. The operator has full control of the movement of the capillary by varying the position of the lever, when the lever is moved from the fully up position the clamps open as in Step 2 and the operator can maneuver and search with the lever for precise www. Suitable for Gold wire bonding or Ball Bumping / TAB bonding. Machine Specification. Please see Home Page for stock. KS /6 Manual Wedge Bonder: /6 Wedge Bonder (Previous KS Model) Suitable for Aluminium or Gold wire. /6 Machine Specification. Please see Home Page for stock. KS Manual Ball Bonder. We have a full range of repair capabilities that have earned us the reputation as a leading semiconductor equipment, training and repair company with a high proficiency hard to find parts for a variety of machines including the entire KS line KS Model Manual Wedge Bonder, KS Model Manual Ball Bonder, KS Model AD Semiautomatic.

At Bridge Tronic Global, we have 'KS Wire Bonder ' available for sale. Please contact us at sales@www.doorway.ru or + Home › Forums › Game of Thrones › Ks wire bonder manual Tagged: , bonder, Ks, Manual, wire This topic has 0 replies, 1 voice, and was last updated 1 year, 11 months ago by Anonymous. Viewing 1 post (of 1 total) Author Posts Septem at pm # AnonymousInactive.. Ks . Model Universal Ball Bonder * optional chessman/ manual dual operating modes * front panel electronic setting of parameters * individual parameters for 1st and 2nd bond * constant tail system, electronically controlled * built-in phase-locked-loop U/ S generator with high-Q transducer dc servo / L VDT-controlled bonding head.

KICKER SOLENOID throws the kicker forward against the wire, pulling wire off the spool. CLAMP SOLENOID operates the wire clamp, opening and closing the clamp on. To prevent electric shock, never touch the EFO wand or hold the wire with your fingers (or tweezers) during spark generation, or when pressing the red “MANUAL. Manual Z lever; manually lowers the capillary to the work piece and activates the bonding process when in the lowest position then returns to home position. if.